National Intellectual Property Society of Iranian Americans |
May, 15 2013
NIPSIA is very proud that Mr. Farhang Yazdani, the President and Chief Technical Officer of BroadPak Corporation, accepted its invitation and presented a lecture at the USPTO on "Advances in 2.5D/3D Silicon Interposer Packaging Technologies" for the USPTO patent examiners, at TC 2800 TechFair.
As the semiconductor industry migrates toward extreme monolithic foundry level 3D heterogeneous structures for mixed-signal components and systems, 2.5D/3D silicon interposer and through silicon via (TSV) technology will play a significant role in next generation 3D packaging technologies. Ubiquitous 3D IC integration offers numerous benefits, notably, higher bandwidth, smaller footprint and lower power. 2.5D/3D approaches, such as interposers, enable heterogeneous device integration at virtually any process node. 2.5D/3D integration technologies rely on numerous leading edge technologies such as, TSV technology, wafer thinning/handling technology and micro-bump technology.
This lecture covers the fundamentals of IC packaging technologies followed by more advanced topics such as the emerging 2.5D/3D silicon interposer technologies.